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机构地区:[1]电子科技大学电子薄膜与集成器件国家重点实验室,成都610054
出 处:《真空科学与技术学报》2010年第5期492-495,共4页Chinese Journal of Vacuum Science and Technology
基 金:国家重点基础研究发展计划"973"(61363);国家自然科学基金项目(50772019)
摘 要:采用脉冲激光沉积技术在(0001)取向的GaN基片上以TiO2为缓冲层外延生长了PZT(111)单晶薄膜。X射线衍射分析表明PZT(111)衍射峰的摇摆曲线半高宽为0.4°,说明薄膜结晶性能良好。PZT薄膜疲劳特性测试结果表明,在经过107次翻转后PZT薄膜的剩余极化强度开始出现下降。P-E电滞回线和I-V测试表明PZT薄膜矫顽场(2Ec)为350 kV/cm,剩余极化(2Pr)约为96μC/cm2,在1 V电压下薄膜的漏电流密度为1.5×10-7A/cm2。以上性能测试结果表明,在半导体GaN上外延生长的PZT铁电薄膜性能基本满足铁电随机存储器的需要。The( 111 )oriented lead zirconate titanate, PbZr0.52Ti0.48O3 (WZT),films, were grown by pulsed laser deposition on substrates of GaN and TiO2-coated GaN, respectively. The microstructures and ferroelectric property of the PZT films were characterized with X-ray diffraction and conventional measurement. The influence of the film growth conditions, including deposition rate, annealing temperature and TiO2 buffer layer, on the epitaxial growth of the PZT films was stud- ied. The results show that the TiO2 buffer layer significantly improves the microstructures and ferroelectric property of the epitaxially grown PZT films. In addition, the PZT film material deposited on TiO2 coated GaN was found to be good enough to fabricate ferroelectric random access memory devices.
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