衬底基片精密加工过程中宏观质量控制  

Macro quality control on ultra-precision machining of substrates

作　　者：周海[1] 白立刚[1,2] 赵梓皓[1,2] 王黛萍[1] 

机构地区：[1]盐城工学院机械工程学院,盐城224051 [2]江苏大学机械工程学院,镇江212013

出　　处：《机械设计与制造》2010年第9期259-261,共3页Machinery Design & Manufacture

基　　金：江苏省自然科学基金资助项目(BK2008197);江苏省科技厅科技攻关项目(BE2007077);江苏省"青蓝工程"项目;盐城工学院重点建设学科开放项目(XKY2009059)

摘　　要：衬底基片的宏观质量包括外形完整性、翘曲度、尺寸精度等。在分析衬底基片精密加工工艺基础上,得出影响宏观质量的因素有:晶片切片方式、粘盘的方法、研磨抛光崩边、表层应力、抛光液的成份。提出采用线切割、真空粘盘,提高坯料的平整度。采用预加工保护倒角、嵌入式行星保持架,防止抛光崩边。根据不同的衬底基片选择合适的抛光垫,配置专用化学机械抛光液,使得衬底基片化学反应速度与机械去除速度协调。从而有效控制衬底基片的宏观质量。实现了衬底基片表面完整、翘曲度小于5微米、厚度误差小于3微米。Macro-quality of the substrate includes the shape integrity,warp ,accuracy. Based on the analysis af processing of substrates ,the factors that affect the quality of macro quality include wafer slicing method,sticky method,edge collapse ,surface stress ,slurry composition. The flatness has been improved by wire cutting and stick vacuum. The collapse of edge has been prevented by pre -processing to protect chamfer,embedded planet cage. Polishing pod has been selected according to substrate. Configuration specific CMP fluid makes the substrate chemical reaction speed and mechanical removal rate to coordinate. The macro-quality of the substrate has been effectively controlled. Warp is less than 5 microns. Thickness error is less than 4 microns.

关 键 词：衬底基片 表面完整性 翘曲度 化学机械抛光 

分 类 号：TH161[机械工程—机械制造及自动化] TN205[电子电信—物理电子学]