ABS塑料电镀全套前处理工艺  

Pretreatment Technology for Electroplating of ABS Plastics

作　　者：舒畅[1] 谢光荣[1] 朱有兰[1] 

机构地区：[1]广东工业大学材料与能源学院,广东广州510006

出　　处：《材料保护》2010年第9期59-60,共2页Materials Protection

基　　金：广东省与教育部产学研合作项目(2009A090-00022)资助

摘　　要：详细介绍了ABS塑料电镀前处理工艺的过程。通过试验优化出化学镀铜最佳配方及参数:16g/L硫酸铜,25mL/L37%甲醛,20g/L酒石酸钾钠,5g/L氢氧化钠,2g/L氯化铵;磁力搅拌,恒温50℃,pH值为12,沉积30min。所得铜镀层均匀、光亮,厚度为2～3μm,符合GB/T12600-1990要求。Pretreatment technology for electroplating of ABS plas-tics was introduced detailedly.The optimization of bath composi-tion and process parameters of electroless Cu plating was investi-gated.Based on a series of experiments,the optimized composi-tion of the bath was determined to be 16 g/L CuSO4,25 mL/L 37% HCHO,20 g/L KNaC4H4O6,5 g/L NaOH and 2 g/L NH4Cl.The optimized conditions for electroless Cu plating were suggested as magnetic stirring,constant temperature of 50℃,pH value of 12 and deposition time of 30 min.Resultant electroless Cu coating with a thickness of 2～ 3 μm was uniform and bright,meeting relevant requirements specified in national standard GB/T 12600-1990.

关 键 词：ABS塑料 电镀 前处理 化学镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]