双功能苯并恶嗪聚合物的制备及抗粘性能研究  

Synthesis and Anti-Adhesive Properties of Bi-Functional Benzoxazine Polymer Films

作　　者：曲丽[1] 辛忠[1] 陆馨[1] 董会杰[1] 

机构地区：[1]华东理工大学化学工程联合国家重点实验室,上海200237

出　　处：《微纳电子技术》2010年第9期537-543,共7页Micronanoelectronic Technology

基　　金：上海市科委纳米技术专项资助课题(0652nm001)

摘　　要：合成了苯并恶嗪单体B-a,通过非等温和等温DSC测量考察了单体的热固化行为;考察了固化温度及固化时间对聚合物膜表面能的影响,并对其热稳定性进行了研究。结果表明,随着固化温度的升高,单体聚合所得聚合物的表面能先降低后基本保持不变,达到210℃后所得聚合物表面能即没有显著变化,在210℃下随着固化时间的增加,单体聚合所得聚合物的表面能先降低后升高,在固化时间为1h时所得聚合物表面能最低,单体在210℃固化1h所得聚合物膜的表面能为16.73mN/m,比纯的聚四氟乙烯的表面能(21mN/m)还要低,该条件下得到聚合物膜的表面粗糙度仅为0.204nm,玻璃化转化温度为161℃,失重5%的温度T5为334℃,可以作为抗粘材料应用在热压印技术中。The benzoxazine monomer B-a was synthesized, and the thermal curing of the monomer was investigated by non-isothermal and isothermal differential scanning calorimetry （DSC） measurements. The influences of the thermal curing temperature and thermal curing time on the surface free energy of the polymer films were investigated, and its thermal properties were studied. The result shows that the surface free energies of the polymer films decrease firstly with the increase of the thermal curing temperature and then vary insignificantly after curing at 210 ℃. The surface free energies of the polymer films decrease initially and then increase steadily with the increase of the curing time at 210 ℃, and the surface free energy is lowest at curing for 1 h to reach 16. 73 raN/m, even lower than that of Teflon （21 raN/m）. The root-mean-square roughness of the polymer film is 0. 204 nm, the glass transition temperature is 161 ℃, and the 5% weight loss temperature is 334℃. The polybenzoxazine film is suitable for the anti-sticking application of the hot embossing nanoimprint lighography .

关 键 词：纳米压印 聚苯并恶嗪 聚合物膜 抗粘性能 热稳定性 

分 类 号：O647[理学—物理化学]