Clearfil SE Bond以及Super Bond C和B粘接纵折牙后的应力分析  

Stress analysis of Clearfil SE Bond and Super Bond C and B in splicing the vertically fractured tooth

作　　者：徐永佳[1] 俞立英[1] 陈琼[1] 王淑敏[1] 熊焕国[2] 

机构地区：[1]复旦大学附属华山医院口腔科,上海200040 [2]上海第二工业大学机械工程系,上海201209

出　　处：《国际口腔医学杂志》2010年第5期525-529,共5页International Journal of Stomatology

摘　　要：目的指导折裂牙粘接材料的选择。方法以美国商用有限元系统ALGOR软件建立下颌第一磨牙纵折三维有限元模型,分别以Clearfil SE Bond以及Super Bond C和B粘接折裂牙,而后施加垂直和倾斜载荷以获取折裂牙的应力分布情况。结果纵折牙粘接回植后承受的应力及其变化趋势接近于健康牙;而以Clearfil SE Bond粘接治疗的牙体,承受应力变化的能力优于Super Bond C和B。结论纵折牙回植应选用与牙本质弹性模型更为接近的粘接材料。Objective To provide instruction for the choice of adhesive materials in splicing the vertically fractured tooth. Methods The three dimensional finite element model of the vertically fractured tooth of mandibular first molar was established by American commercial finite element software ALGOR. The fractured tooth was spliced by Clearfil SE Bond or Super Bond C and B,and then the stress distribution of it with vertical and tilt force was analyzed. Results The stress distribution of spliced tooth with Clearfil SE Bond or Super Bond C and B was close to healthy tooth,and Clearfil SE Bond was prior to Super Bond C and B. Conclusion The adhesive mate-rial with the elastic medulus close to dentin should be the prior choice in splicing the vertically fractured tooth.

关 键 词：纵折牙 三维有限元 生物力学分析 

分 类 号：R783.1[医药卫生—口腔医学]