光溅射镀膜均匀性的优化模拟  

Optimal Simulation for the Thickness Uniformity of the Film Deposited by Pulse Laser Sputtering

作　　者：王晟[1] 叶景峰[1] 刘晶儒[1] 白婷[1] 叶锡生[1] 王立君[1] 

机构地区：[1]西北核技术研究所,西安710024

出　　处：《光子学报》2010年第9期1543-1546,共4页Acta Photonica Sinica

基　　金：国家高技术研究发展计划804主题军口资助

摘　　要：为了改善脉冲激光溅射沉积大面积薄膜的均匀性,发展了基片离轴旋转的扫描技术.根据基片离轴旋转的基本原理和等离子体羽空间余弦分布规律,建立了径向膜厚分布公式.数值模拟了各种因素对基片离轴旋转扫描沉积薄膜均匀性的影响.分析表明,优化粒子束中心与基片中心偏置距离、溅射点与基片的距离是改善基片离轴旋转扫描镀膜均匀性的主要途径.同时也考虑了电机转速、镀膜时间和激光重频的影响.通过参量优化,当均匀度要求在95%时,计算得到薄膜的最大半径超过40mm.Method of off-axis rotated scan is studied in order to improve the thickness uniformity of the film by pulse laser deposition （PLD）. Based on the principle and spatial distribution of plasma,radial distribution formula of film thickness is formed. Effects on uniformity of film deposited by method of off-axis rotated scan are simulated numerically. The simulated results show that optimize of d （distance between sputtering dot and foundation） and r （interval between particle center and foundation center ） are primary means for improving the uniformity of film. In addition,influence of electromotor rotate speed,working time and laser repetition frequency is considered. Simulated with optimal parameters,maximum radius of film diameter over 40 mm is obtained when 95% uniformity is required.

关 键 词：薄膜 基片离轴旋转扫描 均匀性 脉冲激光镀膜 

分 类 号：TN249[电子电信—物理电子学]