氨基磺酸盐低应力镀镍工艺  

Process of Low Stress Ni Electroplating with Amino Sulphate

作　　者：王辉[1] 

机构地区：[1]沈阳黎明航空发动机(集团)公司热表处理厂,沈阳110043

出　　处：《腐蚀与防护》2010年第9期726-728,共3页Corrosion & Protection

摘　　要：通过对氨基磺酸盐镀镍工艺获得的低应力镀镍层进行结合力、氢脆、耐蚀性等测定,确定了低应力氨基磺酸盐镀镍的预处理工艺、镀镍配方及电镀工艺参数,同时研究了低应力镀镍液成分及工艺参数对镀层应力的影响。试验结果表明,这种低应力镀镍工艺获得的镀层具有应力低、结合力好和低氢脆性等性能。The pre-treatment process and electroplatlng process parameters of low stress Ni electroplating using amino sulphate were studied by testing the properties of binding force, hydrogen embrittlernent and corrosion resistance And the effect of electroplating hath content and process parameters on the binding force of electroplated coating was analyzed. The results showed that the low stress etectroplated coating had good binding force and low hydrogen embrittlement.

关 键 词：低应力 氨基磺酸盐 镀镍 

分 类 号：TQ153.1[化学工程—电化学工业]