电子组装钎焊缺陷研究  

Study on Defect of Lead-free soldering

作　　者：宋长发[1] 

机构地区：[1]桂林电子科技大学应用科技学院,广西桂林541004

出　　处：《电子工艺技术》2010年第5期278-280,302,共4页Electronics Process Technology

摘　　要：针对电子组装无铅钎焊在实际生产中出现的缺陷进行了分析研究,找出导致焊点表面粗糙、焊锡珠、漏焊、空洞和钎焊点合金层退变等钎焊缺陷的原因,通过反复试验,提出解决问题的方法,经生产实践证明,这些方法行之有效,对解决其它产品出现类似问题具有指导意义。The defects of lead-free soldering in production are discussed.The reasons of soldering defects,such as,rough appearance of solder joints,soldering balls,solder skips,voids,degeneration of intermetallic compounds and so on,are probed.Methods to solve above issues are proposed by experiments.It is proved by production practices that the methods are effective,and are reference for solving problems appeared on other products.

关 键 词：无铅钎焊 焊锡珠 漏焊 空洞 金属间化合物 钎焊点缺陷 

分 类 号：TN60[电子电信—电路与系统]