指数型功能梯度材料平面问题热应力通解  

The General Solution of the Plane Thermal Stress in the Functional Materials with Exponential Variation of Constans

作　　者：刘俊俏[1] 段惠琴[1] 董淑转[1] 

机构地区：[1]运城学院应用数学系,山西运城044000

出　　处：《数学的实践与认识》2010年第19期100-103,共4页Mathematics in Practice and Theory

基　　金：国家自然科学基金(10962008);运城学院院级项目(JC-20090080)

摘　　要：研究了功能梯度材料平面问题的热应力场,首先引入热弹性位移势函数,得到温度场的应力解;然后引入Airy应力函数,通过求解功能梯度材料平面问题的基本方程,得到不考虑温度时的应力,叠加后得到平面问题的热应力通解.The thermal stress field in the functional graded materials（FGMs） plane is investigated.First of all,the stress caused by the thermal has been obtained by introducing the displacement function.Secondly,the stress on no consideration of the thermal has been derived by using Airy stress function.At last,the general solution of the thermal stress is given on the bases of the stress adding.

关 键 词：功能梯度材料 偏微分方程 热应力 

分 类 号：O343.6[理学—固体力学]