三维微波集成电路的发展  

The Development of Three Dimensional Microwave Integrated Circuits

作　　者：王安国[1] 吴咏诗[1] 

机构地区：[1]天津大学电子信息工程学院

出　　处：《微波学报》1999年第2期167-173,共7页Journal of Microwaves

基　　金：国家自然科学基金

摘　　要：近几年来，三维微波集成电路的研制在各方面均取得了一定的进展，作为新一代体积更小的微波集成电路，必将随着信息时代的发展，在移动通信、卫星直播电视等装置中获得广泛应用。本文综述三维微波集成电路近几年来的发展。The study of three dimensional microwave integrated circuits (3DMIC) has made great progress in recent years. As a new generation of microwave integrated circuit with smaller size, 3DMIC will be widely used in mobile communication equipments, satellite direct broadcasting television equipments and so on. In this paper, a survey about the development of three dimensional microwave integrated circuits in recent years is given.

关 键 词：三维 微波集成电路 单片 多层 

分 类 号：TN454[电子电信—微电子学与固体电子学]