基于ST350返修台的回流焊接温度曲线研究  

Based on ST350 rework equipment solder reflow temperature profile study

作　　者：朱桂兵[1] 陈文所 

机构地区：[1]南京信息职业技术学院,南京210046 [2]南京熊猫电子集团,南京210046

出　　处：《机械设计与制造》2010年第10期126-128,共3页Machinery Design & Manufacture

基　　金：南京信息职业技术学院科研项目(YKJ08-006)

摘　　要：主要讨论了温度曲线在电子产品回流焊接工艺中的成因,通过对多种焊膏使用工艺的跟踪检测,研究在SMT制造工艺中影响回流焊接温度曲线的主要因素,诸如回温焊膏、搅拌焊膏、焊膏印刷厚度与外形、PCB传输速度、各加热区温度设定、回流炉对流导热率以及回流炉技术参数等等,得出比较贴切的近似值以供温度曲线参考,提高工作效率,并针对性地提出工艺改善方法,优化生产工艺。It mainly discussed the causes of temperature profile in electronic products reflow soldering process,through to tracking test the using craft of many kinds of solder paste,researched the major factor of affecting the reflow soldering temperature profile,such as warming up solder paste、churning up solder paste、the thickness and figure of solder paste printing、the PCB transmission speed、the heating zone temperature setting、the reflow furnace convection thermal conductivity and the technical parameter of reflow furnace and so on,obtained the quite appropriate value to supply the temperature profile reference,enhanced the working efficiency,and proposed the pointed craft improvement method,optimized the produced craft.

关 键 词：温度曲线 焊接 回流炉 表面组装技术(SMT) 

分 类 号：TH16[机械工程—机械制造及自动化]