真空共晶设备的改进对共晶焊接质量的影响  

Effect of Vacuum Brazing Equipment Improvement On Brazing Welding Quality

作　　者：张建宏[1] 王宁[1] 杨凯骏[1] 井文丽[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2010年第10期44-47,共4页Equipment for Electronic Products Manufacturing

摘　　要：共晶焊接质量对芯片的可靠性及寿命影响很大。在这方面,通过改进后的真空共晶设备比改进前更具有优势。分析了真空环境对共晶焊接的影响,在原有设备增加了分子泵的情况下,实现无空洞焊接。对甲酸气体保护下的In焊料焊接进行了分析,并结合实际经验给出合理的工艺曲线,证实了在真空室加入甲酸气体的保护下,可以把In焊料表面的氧化层去除,使焊料在浸润性方面具有明显的优势。Brazing welding quality is an important factor to the reliability and life of chips.In this respect,improved brazing vacuum equipment has more advantages than before.Vacuum environment affecting brazing welding is analyzed and the voids free chips after brazing are gotten through increasing molecular pump in the existing equipment.In-solding welding under the protection of formic acid gas is anayzed and a proper proless curve was abtained,meantime.If formic acid gas is added in vacuum chamber,the oxidation at the interface of In-solding will be reduled and the wetting property is much better.

关 键 词：真空 共晶 空洞 甲酸 

分 类 号：TG456[金属学及工艺—焊接]