异氰酸酯制备无醛胶合板的研究——热压工艺参数的优化  

Plywood with Polymeric Diphenylmethane Isocyanate:Optimization of Hot-pressing Conditions

作　　者：祝荣先[1] 于文吉[1] 

机构地区：[1]中国林业科学研究院木材工业研究所,北京100091

出　　处：《东北林业大学学报》2010年第10期58-60,84,共4页Journal of Northeast Forestry University

基　　金："十一五"国家科技支撑计划重大项目(2006BAD19B0504);中国林科院林业新技术所基本科研业务费专项基金(CAFINT2008C09)

摘　　要：选择热压温度、热压时间、热压压力、板坯含水率、施胶量5个工艺参数,系统研究了在用异氰酸酯生产无醛胶合板时热压工艺条件对胶接性能的影响。结果表明:热压温度、热压时间、热压压力对胶合板胶接性能的影响比较显著;当热压温度控制在110～120℃之间、热压时间为1.0～1.2min/mm、热压压力为0.8～1.2MPa、施胶量为20g/m2左右、板坯含水率为8%～23%时,可以制得胶合强度符合国家Ⅰ类胶合板标准的无醛胶合板。The purpose of this study was to investigate the effect of hot-pressing temperature,hot-pressing time,hot-pressing pressure,mat moisture content and resin content on the bonding properties of the formaldehyde-free plywood panel.Results showed that the bonding strength was significant influenced by hot-pressing temperature,time and pressure.The optimal hot-pressing conditions were obtained as temperature between 110 degrees C and 120 degrees C,time 1.0-1.2min/mm,pressure 0.8-1.2MPa,resin content about 20g/m^2,and mat moisture content between 8% and 23%.The properties of the plywood were preferable under the optimal conditions,which reached the gradeⅠ national standard of formaldehyde free plywood panels.

关 键 词：无醛胶合板 异氰酸酯 热压工艺参数 胶合强度 

分 类 号：TS653[轻工技术与工程]