增强军用电路板组件环境适应性的一种方法  

Method to Enhance Environmental Adaptability of Military Printed Circuit Board Assemblies

作　　者：曲利新[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《现代电子技术》2010年第21期41-42,50,共3页Modern Electronics Technique

基　　金：国家863计划项目支持(2006AA701410)

摘　　要：军用电子装备的质量和可靠性与其环境适应性密不可分。为满足战备需求,提高装备的环境适应性能力,必须加强装备的防护能力建设。通过对电子装备核心基础部件印制电路板组件的固封设计、实施和试验验证,证明它是一种有效增强印制电路板组件环境适应性的方法。The quality and reliability of military electronic equipments have close contact with their environmental adaptability.Therefore,the defensive capability of the equipments must be strengthened so as to meet the needs of combat readiness and improve their environmental adaptability.The fixation and encapsulation of printed circuit board assemblies which are the core and basic components of military electronic equipments are proposed.The experiment proves that the method to enhance the environmental adaptability of printed circuit board assemblied by fixation and encapsulation reinforcement is effective.

关 键 词：电子装备 环境适应性 印制电路板组件 固封 

分 类 号：TN710-34[电子电信—电路与系统]