植入式柔性神经微电极的互连方法  

An electrical interconnect method for implantable flexible neural microelectrodes

作　　者：周亮[1,2] 朱壮晖[1,2] 张华[1] 周洪波[1] 孙晓娜[1,2] 李刚[1] 赵建龙[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所,上海200050 [2]中国科学院研究生院,北京100039

出　　处：《功能材料与器件学报》2010年第5期471-478,共8页Journal of Functional Materials and Devices

基　　金：国家973计划(No.2005CB724305);上海市自然科学基金项目(No.07ZR14134);上海市AM基金项目(No.08520740300);中国科学院上海微系统与信息技术研究所青年创新基金项目(No.2008QNCX02)

摘　　要：为了实现植入式柔性神经微电极与外部记录或刺激装置的有效、可靠连接,本文提出了一种基于通孔电镀的植入式柔性神经微电极互连方法。该方法首先制作具有通孔结构的柔性互连膜,并将其通孔与待连接的植入式微电极焊接位点对准贴合,然后电镀生长导通金属,从而实现与待连接的植入式器件的柔性连接。最后本文通过SEM观察、电学性能测试、机械强度测试以及生物兼容性测试等手段对此互连方法的焊接效果进行了评价。测试结果表明本文提出的柔性微电极互连方法具有很好的可靠性和稳定性。In order to achieve efficient and reliable interconnection between implantable flexible neural microelectrodes and external stimulation and record devices,an electrical interconnect method based on via-hole electroplating has been presented in this paper.In this method,a flexible interconnect film including via-hole structures was first fabricated,and then bonded on a flexible neural microelectrode after aligning its via-holes with the welding pads of the flexible neural microelectrode.After that,an electroplating process was performed to fill the via-holes with the growth of metal,which could form an electrical connection between the flexible interconnect film and the flexible microelectrode.Finally,the fabricated devices were investigated by SEM,electrical performance test,mechanical strength test,and biocompatibility test.The results show that the proposed interconnection method for the flexible microelectrodes has good reliability and stability.

关 键 词：柔性基底 神经微电极 电镀 互连 

分 类 号：TB381[一般工业技术—材料科学与工程]