YBCO超导芯片Ag-Au电极金带压接实验探讨  

Experiments on gold-band connection with Ag-Au electrodes on YBCO chip

作　　者：丁晓杰[1,2] 张峥[1,2] 黄振辉[1,2] 胡来平[1,2] 

机构地区：[1]中国电子科技集团公司第16研究所,合肥230043 [2]中国电子科技集团公司低温电子技术研发中心,合肥230043

出　　处：《低温与超导》2010年第11期25-27,共3页Cryogenics and Superconductivity

摘　　要：针对超导芯片与其它电路可靠连接的难题开展了超导芯片电极引线键合的实验研究。在超导薄膜芯片上先制作了银-金电极,然后利用热声焊接原理,将100μm×25μm金带键合至电极表面,最后进行电极引线拉力测试。依据GJB548B-2005关于键合强度的规定,初步确定了键合工艺参数。S波段超导滤波器应用实例表明,以该方法实现电路互联,其微波性能优异。Experiments on an electrode wiring were carried out to improve the connection between superconducting chip and other curcuits.First,Ag-Au electrodes were coated on the chip.Then,a gold band with 100μm×25μm was wired to the surfaces of the electrodes based on thermalsonic welding principle.Finally,the tension for bonding wire was measured.According to requirements of GJB548B-2005 standards,technical parameters were determined.A superconducting filter at S waveband was fabricated by means of the experiment method.Results show that the filter has excellent properties.

关 键 词：超导芯片 电极 键合 

分 类 号：TM262[一般工业技术—材料科学与工程]