新型配位剂对化学镀铜工艺的影响  

Effects of a Novel Complexing Agent on Electroless Copper Plating Technology

作　　者：刘桂媛 郑连德 张锦秋 

机构地区：[1]青岛杰美科表面处理有限公司,山东青岛266500

出　　处：《电镀与环保》2010年第6期33-35,共3页Electroplating & Pollution Control

摘　　要：在以柠檬酸钠为配位剂、次磷酸钠为还原剂的化学镀铜工艺的基础上,加入一种新型配位剂,研究了新的化学镀铜工艺。比较了新化学镀铜工艺与传统的化学镀铜、化学镀镍工艺的不同。结果表明:新型化学镀铜工艺沉积速率快、镀液稳定性好、成本低,是很好的代镍工艺。A new electroless copper plating technology was developed by adding a novel complexing agent to an electroless copper plating electrolyte which contains sodium citrate as complexing agent and sodium hypophosphite as reducing agent.The differences were compared among the new electroless copper plating technology,traditional electroless copper plating technologies and electroless nickel plating technologies.The results show that the new electroless copper plating technology has a high deposit speed,a stable electrolyte and a low price,and is good to replace electroless nickel plating.

关 键 词：化学镀铜 配位剂 代镍工艺 

分 类 号：TQ153[化学工程—电化学工业]