多芯片焊球阵列封装体受热载荷作用数值模拟  

Numerical Simulation of Multi-Chip Ball Grid Array Package Under Thermal Loading

作　　者：毛佳[1] 江振宇[1] 陈广南[1] 张为华 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《国防科技大学学报》2010年第5期23-28,共6页Journal of National University of Defense Technology

基　　金：国家863高技术资助项目(2007AA702503)

摘　　要：针对典型高密度多芯片BGA(焊球阵列)封装体建立三维有限元分析模型,研究不同尺寸封装体在稳态热载荷作用下的结构变形和应力情况,在此基础上引入包含等效梁和危险焊球真实几何形状和间距等在内的简化模型以进行序列分析,研究各设计参数对力学参量的影响。数值结果反映了封装体应力分布及其变化特点,表明影响封装体变形和应力的主要参数;提出的建模方法简便有效,可以方便地用来分析不同类型的BGA封装,并扩展应用至不同的分析目的,为此种结构的设计和优化提供一定参考。Three dimensional parametric finite element analysis models were created for typical high density BGA（Ball Grid Array） package to analyze the structure deformation and stress when loading steady temperature upon packages with different sizes.A simplified model for series analysis including equivalent beam and critical solder ball was established to analyze the effect of design parameters upon the mechanical properties of the package.The numerical results reflected the stress distribution and varying traits of the package,main parameters affecting the deformation and stress were identified.The method developed is convenient and effective.Also it can be applied for analysis of different types of BGA,or can be used for different analysis purpose,and is of certain reference value for the design and optimization of such kind of packages.

关 键 词：多芯片组件 焊球阵列封装体 参数化有限元模型 热载荷 热应力 

分 类 号：TB330.1[一般工业技术—材料科学与工程]