基于非接触式热压印技术的微透镜阵列制作  

Manufacture of microlens arrays based on contactless embossing

作　　者：王迎春[1] 谢丹[1] 张鸿海[1] 

机构地区：[1]华中科技大学机械科学与工程学院,湖北武汉430074

出　　处：《机电工程》2010年第11期13-16,共4页Journal of Mechanical & Electrical Engineering

摘　　要：为了降低热压印工艺制作微透镜阵列对模具的要求,提出了非接触式热压印工艺制作微透镜阵列,采用了自主研制的纳米压印样机与光刻工艺制作的通孔式不锈钢模具在PMMA表面压印出微透镜阵列,并分析了压印过程中温度、压力、时间等参数对微透镜阵列表面形貌的影响。研究结果表明,利用非接触式热压印工艺可以制作表面形貌好、位置精度高的微透镜阵列,压印时最佳压印温度为140℃~180℃,最佳脱模温度为80℃,最佳压力为1 500 Pa^3 500 Pa,且采用通孔式模具不需要真空,降低了对环境的要求。In order to reduce the requirement of the molding tool used by hot embossing for fabricating microlens arrays,the method of fabricating microlens arrays by contactless embossing was proposed.An independently developed nanoimprint machine and a stainless molding tool manufactured by photolithography with through-holes were used to fabricate microlens arrays on PMMA sheet.Influences of the temperature,the applied pressure and the embossing time on the focus of the microlenses were analyzed.The experimental results show that microlens arrays with good surface features and high position precision can be fabricated by contactless embossing.The optimum imprint temperature is 140℃ to 180℃,the optimum temperature for demoulding is 80℃,and the best applied pressure is 1 500 Pa to 3 500 Pa.Meanwhile,vacuum support is unnecessary when using the molding tool with through-holes,which can reduce the requirement of the environment.

关 键 词：微透镜阵列 非接触式 光刻 通孔式 

分 类 号：TH741.8[机械工程—光学工程]