有机电致发光显示器用框胶封装材料的研制  

Study on preparing sealant for encapsulation material of OLED

作　　者：李会录[1] 南峰[2] 李东辉[1] 涂天平[1] 

机构地区：[1]西安科技大学材料系,陕西西安710054 [2]西安建筑科技大学材料系,陕西西安710054

出　　处：《中国胶粘剂》2010年第11期45-48,共4页China Adhesives

摘　　要：以聚氨酯丙烯酸树脂、环氧丙烯酸/聚氨酯丙烯酸混合树脂、氨基甲酸酯丙烯酸聚硅氧烷树脂和环氧丙烯酸树脂分别作为基体树脂,制备有机电致发光显示器(OLED)用框胶封装材料。结果表明:氨基甲酸酯丙烯酸聚硅氧烷树脂基框胶的综合性能较好,其粘接强度为33.5 MPa、玻璃化转变温度为135.02℃、水汽穿透率为9.3 g/(m2.d)和氧气穿透率为0.021 mL/(m2.d),满足OLED用框胶封装材料的使用要求。A sealant for encapsulation material of the organic light emitting diode（OLED） was prepared when the polyurethane acrylic resin,the epoxy acrylic/polyurethane acrylic mixture resin,the carbamate acrylic polysiloxane and the epoxy acrylic resin were respectively used as matrix resins.The results showed that the sealant based on the carbamate acrylic polysiloxane had well combination property and could meet application requirement of sealant for encapsulation material of OLED because its bonding strength was 33.5 MPa,glass transition temperature was 135.02 ℃,moisture penetration rate was 9.3 g/（m2·d） and oxygen penetration rate was 0.021 mL/（m2·d）.

关 键 词：基体树脂 粘接强度 水氧气穿透率 有机电致发光显示器 封装材料 密封胶 

分 类 号：TQ437.6[化学工程]