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机构地区:[1]北京科技大学材料科学与工程学院,北京100083
出 处:《材料热处理学报》2010年第11期37-41,共5页Transactions of Materials and Heat Treatment
基 金:国家自然科技基金项目(50971026);国家高技术研究发展计划(2008AA03Z503)
摘 要:研究了在奥氏体区轧制、650℃模拟卷曲后含铜低碳低硅无取向电工钢中的析出相及其析出规律。结果表明:含铜低碳低硅无取向电工钢中的析出相主要有弥散分布的、等轴状的Cu偏聚区和形状近似正方形的颗粒状的AlN。Cu偏聚区在卷曲5min后即出现,其平均尺寸为20~30nm,且一旦形成长大缓慢。高分辨电子显微镜观察表明,偏聚区是由许多微区组成,且各微区的原子排列可能存在一定的对称性;而AlN在卷曲10min后才出现,大大晚于Cu偏聚区,且一旦形成长大迅速,卷曲32min后,其尺寸便达120nm。The precipitates in low carbon low silicon non-oriented electrical steel containing Cu rolled in the austenite region and simulated coiled at 650 ℃ were studied.The results show that dispersed,equiaxed Cu clusters and approximately square,granular AlN formed in the non-oriented electrical steel containing Cu.Cu clusters appeared in the specimen aged at 650 ℃ for 5min,and their average size is 20-30 nm.And the formed Cu clusters,grew slowly.Further observation by high-resolution electron microscope showed that cluster was composed of many sub-microstructure.On the contrary,AlN precipitates appeared in the specimen aged at 650 ℃ for 10 min showed.But once formed,they grew fast.Their size reached 120 nm in the specimen aged at 650 ℃ for 32 min.
分 类 号:TG142.77[一般工业技术—材料科学与工程]
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