金-瓷结合界面与瓷-瓷结合界面的元素扩散  

A study on elements diffusion between metal-ceramic interface and ceramic-ceramic interface

作　　者：崔军[1] 巢永烈[2] 刘学恒[1] 胡爱云[1] 马练[1] 贾黎[1] 

机构地区：[1]北京大学深圳医院口腔科,518036 [2]四川大学华西口腔医院修复科

出　　处：《实用口腔医学杂志》2010年第6期743-746,共4页Journal of Practical Stomatology

基　　金：深圳市科技计划项目资助(编号:200903082)

摘　　要：目的:比较研究金-瓷、瓷-瓷2种结合界面微观形貌以及结合机制。方法:制作15mm×5mm×1mm金-瓷与瓷-瓷双层结构试样各1个,将以上2试样均从中一分为二,自凝塑料包埋,断面经高度打磨抛光并表面喷金,做扫描电子显微镜和能谱分析。结果:扫描电镜发现瓷-瓷界面较金-瓷界面结合更加紧密,无明显间隙。能谱分析显示金-瓷结合界面发生Cr、O、Si元素的扩散,瓷-瓷界面发生Si、Al、K元素的扩散。结论:金-瓷界面与瓷-瓷界面均能达到化学结合,瓷-瓷界面较金-瓷界面结合更紧密。Objective：To compare the bond mechanism and microscopic structures between metal-ceramic and ceramic-ceramic interfaces.Methods：Specimens of alumina glass-infiltrated（15 mm×5 mm×1 mm）and cobalt-chromium alloy（15 mm×5 mm×1 mm）were fabricated,veneering porcelains were sintered on the specimen’s surface.Then the bilayered composites were fractured,invested and polished for scanning electron microscopy（SEM）and energy spectrum analysis.Results：Ceramic/ceramic interface showed tighter connection than metal-ceramic interface.Diffusion of Cr,O,Si across metal-ceramic interface and Si,Al,K across ceramic-ceramic interface were confirmed by energy spectrum analysis.Conclusion：Chemical bond is found between both metal-ceramic and ceramic-ceramic interface.The connection of ceramic-ceramic is smoother and tighter than metal-ceramic interface.

关 键 词：全瓷材料 界面 结合强度 

分 类 号：R783.1[医药卫生—口腔医学]