生瓷带冲孔工艺设备的开发与研制  

Development of LTCC Punching Machine

作　　者：杨卫[1] 王海珍[1] 毋晶晶[1] 沈庚尧[2] 张永聪[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024 [2]后勤指挥学院,北京100858

出　　处：《电子工艺技术》2010年第6期362-364,共3页Electronics Process Technology

摘　　要：主要介绍了LTCC(低温共烧陶瓷)的发展、现状和生瓷带冲孔工艺特性。根据LTCC工艺要求,生瓷带冲孔设备应具备位置精度高、边缘精度高和冲孔速度快的工艺性能。首先分析了生瓷带冲孔设备应解决的技术难点,然后运用精密制造、精密装配、精密控制和光学测量等理论知识,详细阐述了生瓷带冲孔设备的结构特点,包括高速精密运动平台的设计、冲孔单元的设计和无位移夹持工艺。Describe the development and Status of LTCC and characteristics of punching process.LTCC punching machine should have a high accuracy of placement,a high edge precision and a fast velocity according to LTCC process requirements.Analyze the key technologies of punching equipment.Elaborate on the structural characteristics of LTCC punching machine based on precision manufacturing,precision assembly,precision control and optical measurements and other knowledge,including the design of a high precision motion platform,punching unit and the holding process of non-displacement.

关 键 词：LTCC 生瓷带 冲孔 

分 类 号：TN605[电子电信—电路与系统]