MEMS原子自旋陀螺气室芯片加工设备与工艺研究  

Fabrication of atomic vapor cell chip for MEMS atomic spin-polarized gyroscope

作　　者：董海峰[1] 房建成[1] 周斌权[1] 秦杰[1] 万双爱[1] 

机构地区：[1]北京航空航天大学仪器光电学院,新型惯性仪表与系统技术国防重点学科实验室,北京100191

出　　处：《仪器仪表学报》2010年第11期2592-2596,共5页Chinese Journal of Scientific Instrument

基　　金：国家自然科学基金(60736025);微米纳米技术国家级重点实验室基金;国家杰出青年科学基金(60825305)资助项目

摘　　要：原子自旋陀螺是基于原子自旋极化效应的一类陀螺仪,在实现高精度检测的同时,又具有小型化和批量化制造的潜力。本文针对原子自旋陀螺对气室芯片的高浓度补偿气氛要求,结合集成制造的技术趋势,设计制造了能承受20×101.325kPa气压的气室芯片专用键合装置。完成了集成RF线圈的6amagat Amagat为浓度单位,定义为1个大气压0℃情况下单位体积内理想气体的分子数浓度原子自旋陀螺用气室芯片的工艺流程设计并进行了工艺流片。流片结果获得了完整的气室芯片结构,漏率的检测结果为3.0×10-8 Pa·m3/s,验证了装置和工艺的可行性。Atomic spin gyroscope is based on the atomic spin-polarized effect, which has the potential to measure rotation precisely in a small volume, or even on a chip. The atomic vapor cell for spin gyroscope requires high density compensation gas, which is polarized by spin-exchange and used to compensate the magnetic field. A special bonder is designed with maximum pressure up to 20 atm. A fabrication process is designed in which the RF coil is deposited on a glass wafer instead of using an assembly. The atomic vapor cell chip with gas pressure density of 6 amagats is fabricated and the tested leakage rate is about 3.0×10-8 Pa·m3/s. The final structure and leakage rate measurement verify the feasibility of the special bonder and the process.

关 键 词：陀螺 原子自旋 气室芯片 传感器 

分 类 号：TP212.1[自动化与计算机技术—检测技术与自动化装置]