磁控溅射镀膜膜厚均匀性设计方法  

Design method for the thickness uniformity of thin films deposited by magnetron sputtering process

作　　者：宋青竹[1] 张以忱[2] 孙足来 张峻豪[2] 陈旺 

机构地区：[1]沈阳真空技术研究所,辽宁沈阳110042 [2]东北大学,辽宁沈阳110004 [3]中海石油(中国)东海西湖石油天然气作业公司,上海200030

出　　处：《真空》2010年第6期6-9,共4页Vacuum

摘　　要：镀膜工艺中的薄膜厚度均匀性问题是实际生产中十分关注的。本文在现有的理论基础之上,对溅射镀膜的综合设计方法进行了初步的建立和研究,系统的建立可以采用"整体到部分,再到整体"这一动态设计理念,不断完善设计方法,并将设计方法分为镀膜设备工程设计、镀膜工艺设计和计算机数值仿真三大部分。镀膜设备工程设计、镀膜工艺设计及二者的数值仿真这三者之间是相辅相成的,镀膜设备工程设计决定镀膜工艺过程的实现,镀膜工艺促进镀膜设备的升级,而高性能的计算机仿真设计给两者的设计提供了强有力的支持。The thickness uniformity of thin films is a focus of attention in actual production.An integrated design system is therefore proposed theoretically for the thin films deposited by magnetron sputtering process,based on the dynamic concept of design,ie.,starting from the whole to the part then back to the whole so as to perfect the design step by step.The whole design process is thus divided into three parts： equipment design,process design and numerical simulation by computer,and the three parts supplement each other.The process design not only depends on but also upgrades the implementation of equipment design,and the numerical simulation by high-performance computer provides a powerful support for both the designs for equipment and process.

关 键 词：磁控溅射 薄膜厚度均匀性 综合设计系统 数值仿真 

分 类 号：O484[理学—固体物理] TB43[理学—物理]