IC制造作业调度及资源配置机制研究  

Study on Principles of Job Scheduling and Resource Configuration in IC Manufacturing

作　　者：胡尊刚[1] 严利人[2] 周卫[1] 刘志弘[1] 

机构地区：[1]清华大学信息科学与技术国家重点实验室(筹),北京100084 [2]清华大学微电子学研究所,北京100084

出　　处：《微电子学》2010年第6期893-898,共6页Microelectronics

基　　金：国家自然科学基金资助项目(60976013)

摘　　要：考察和分析了当前流行的IC作业调度的算法模式。在此基础上,将制造系统中的作业调度回归到本原意义上,即制造资源优化配置必须保证制造步骤得以实施,得出既处理待加工硅片,也处理加工设备的双资源调度路线。结合判决式实例(Benchmark),给出IC制造领域中静态地匹配单机加工能力和加工片量的设备配置优化算法,以及动态地调度制造资源以维持工厂流水线式并行生产的作业调度方案,使之在机器运行效率、在制品数量和制造周期压缩、生产批的流程制造可预定性等方面,均取得最优化的效果。Current strategies for IC job scheduling were reviewed.As IC manufacturing machines are fixed to workstations,only wafers to be processed at different workstations are scheduled.In this work,it is suggested that machines,as another IC processing resource,may be scheduled too.A two-resource-schedule method was presented,and an IC benchmark process flow was used as an example,in which equipment capability was optimized and job scheduling was adjusted as wafer process.It has been shown that,with this method,higher machine running efficiency,lower wafer-in-process numbers,and shorter wafer processing cycle could be achieved simultaneously for IC manufacturing

关 键 词：IC制造 作业调度 资源配置 

分 类 号：TN705[电子电信—电路与系统]