基于磁控溅射技术的CrCN镀层中碳元素的存在状态  

Existing form of carbon in CrCN coating based on magnetron sputtering plating technique

作　　者：蒋百灵[1] 胡鹏飞[1] 李洪涛[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《材料热处理学报》2010年第12期134-138,共5页Transactions of Materials and Heat Treatment

基　　金：国家"863"科技攻关项目(2005AA33H010)

摘　　要：采用闭合场非平衡磁控溅射离子镀技术在单晶硅(111)衬底上沉积了CrCN镀层,研究了不同C靶电流CrCN镀层的摩擦系数、碳含量和物相组成,并分析了镀层中碳元素的化学态。结果表明:当C靶电流从0增大到1.5 A时,镀层摩擦系数从0.75降至0.3,随着C靶电流的增大,镀层中碳含量呈非线性增大,增速呈从大到小再到大的变化规律。X射线衍射分析表明,随着C靶电流增大,镀层由晶态向非晶态转变;X射线光电子能谱分析表明,碳元素主要以C-C、C-Cr、C-O键形式存在,且随着C靶电流增大,碳键中C-C键的比例也随之增大。CrCN coating was deposited on single crystal silicon（111） substrate using closed-field unbalanced magnetron sputtering ion plating technique.Carbon content and phases of the CrCN coating prepared by different carbon target current were studied,and the chemical state of carbon in the coating was analyzed.The results show that friction coefficient of the coating decreases from 0.75 to 0.3 with the increasing of carbon target current from 0 to 1.5 A.The carbon content in the coating exhibits non-linear increase with a fast increasing rate first to lower value and then the fast again as carbon target current increases.XRD analysis shows that the coating transforms from crystalline state to amorphous state with the increasing of carbon target current.XPS analysis shows that carbon exsits as the form of C-C,C-O,C-Cr bond,and the proportion of C-C bond in carbon bond increases with increasing of carbon target current.

关 键 词：磁控溅射 CrCN镀层 X衍射 X射线光电子能谱 碳键 

分 类 号：TG178[金属学及工艺—金属表面处理]