电刷镀纳米Cu在500℃下的抗氧化性研究  

Oxidation Resistance of Nano-Crystalline Copper Synthesized by Electric Brush-Plating at 500℃

作　　者：刘国军[1] 刘畅[1] 江中浩[1] 

机构地区：[1]吉林大学材料科学与工程学院

出　　处：《特种铸造及有色合金》2010年第12期1093-1096,共4页Special Casting & Nonferrous Alloys

摘　　要：针对电刷镀方法合成的纳米Cu,采用热天平、带有能谱仪的扫描电子显微镜、场发射扫描电子显微镜和X射线衍射仪研究了其在500℃下,压力为0.1MPa纯O2中的氧化行为,结果表明,所研究的纳米Cu的抗氧化能力明显弱于工业纯Cu。High temperature oxidation behavior of nano-crystalline copper synthesized by electric brush-plating at 500℃was observed in 0.1MPa pure oxygen by thermal balance, scanning electron microscope (SEM) and field emission scanning electron microscopy (FESEM) as well as X-ray diffraction (XRD). The results reveal that the oxidation resistance of the prepared nano-copper at high temperature is remarkably lower than that of commercial pure copper.

关 键 词：纳米铜 抗氧化性 晶界 扩散 

分 类 号：TB383.1[一般工业技术—材料科学与工程]