大功率LED封装用散热铝基板的制备与性能研究  

Study on the Fabrication and Performance of Aluminum Substrate for Heat Dissipation of High Power LED

作　　者：方亮[1,2] 钟前刚[1] 何建[1] 刘高斌[1] 李艳炯[1] 郭培[1] 

机构地区：[1]重庆大学应用物理系,重庆400044 [2]重庆大学光电技术及系统教育部重点试验室,重庆400044

出　　处：《材料导报》2011年第2期130-134,共5页Materials Reports

基　　金：重庆市科技攻关计划基金(CSTC2009AC4187);重庆大学"211工程"三期创新人才培养计划建设项目(S-09109);重庆大学大型仪器设备开放基金资助(2010063072)

摘　　要：通过正交试验分析了阳极氧化法制备LED封装用铝基板过程中电流密度、硫酸质量浓度、温度和时间等因素对其热阻、厚度、绝缘电阻率的影响,得到了制备低热阻铝基板的最佳工艺参数。根据优化参数制备了阳极氧化铝基板,将LED分别封装在自制基板和深圳光恒光电公司提供的铝基板上,检测温度与时间变化的关系,结果表明,自制散热铝基板性能更优。The effect of process parameters（current density, concentration of sulfuric acid, temperature and time） on the thermal resistance, thickness,insulation resistivity of Al substrate prepared by the anodizing was studied by an orthogonal experiment. The optimum parameters to fabricate aluminum heat-dissipation substrates for high power LED were obtained. LEDs were packaged on self-made Al substrates prepared at the optimum parameters and that of Guangheng Guangdian company, respectively, then the change of LEDs＇ temperature with lighting time was analysed and compared. It shows that the dissipating heat performance of Al substrates is better than that of Guang-heng Guangdian company.

关 键 词：LED 铝基板 阳极氧化 热阻 厚度 绝缘电阻率 

分 类 号：TB43[一般工业技术]