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作 者:周洪庆[1] 戴斌[1] 韦鹏飞[1] 邵辉[1] 朱海奎[1]
机构地区:[1]南京工业大学材料科学与工程学院,江苏南京210009
出 处:《电子元件与材料》2011年第2期18-20,共3页Electronic Components And Materials
基 金:国家"863"计划资助项目(No.2007AA03Z455);江苏省科技支撑资助项目(No.BE2009168)
摘 要:研究了组分变化对CaO-B2O3-SiO2(CBS)系多元微晶玻璃微观结构、介电性能及相组成的影响。以CBS系微晶玻璃为基础配制生料带,并借助LTCC技术制备了多层微电路基片。探讨了影响LTCC多层微电路低温共烧金属化匹配的相关因素。结果表明:添加不同形态的SiO2均可有效降低微晶玻璃的相对介电常数εr,添加高硅氧玻璃则可增加微晶玻璃的介质损耗。经850℃烧结获得的w(SiO2)为15%的微晶玻璃的εr为6.0且在1~10MHz范围内随频率变化不大,介质损耗为1.2×10-3。CBS系微晶玻璃与金、银浆料能形成匹配良好的LTCC多层微电路。The effects of composition on the microstructure,dielectric properties and phase composition of CaO-B2O3-SiO2 (CBS) glass ceramics were studied.Multilayer microcircuit board was fabricated using the LTCC technique with the raw material tape made from CBS glass ceramics.The factors affecting the low temperature co-fired metallized matching of LTCC multilayer microcircuit were discussed.The results show that addition of SiO2 with different forms decreases the relative permittivity εr of CBS glass ceramics,while addition of high silica glass increases the dielectric loss.For the glass ceramics containing 15% (mass fraction) SiO2 and obtained by sintering at 850 ℃,its relative permittivity is 6.0 and shows little change with frequency in the range of 1~10 MHz,while its dielectric loss is 1.2×10^-3 at 10 MHz.LTCC multilayer microcircuit with good metallized matching can be fabricated from CBS glass ceramics and gold or silver slurry.
分 类 号:TB34[一般工业技术—材料科学与工程]
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