混合稀土对Sn-0.70Cu-0.05Ni钎料组织与性能的影响  

Effect of adding mixed RE on microstructure and properties of Sn-0.70Cu-0.05Ni solder alloy

作　　者：易江龙[1] 张宇鹏[1] 许磊[1] 刘凤美[1] 杨凯珍[1] 

机构地区：[1]广州有色金属研究院焊接材料研究所,广东广州510651

出　　处：《电子元件与材料》2011年第2期25-28,共4页Electronic Components And Materials

基　　金：广东省重大科技专项资助项目(No.2009A080204009);广州有色金属研究院创新基金资助项目(No.1683018)

摘　　要：向Sn-0.70Cu-0.05Ni无铅钎料中添加微量混合稀土元素RE(主要是La和Ce),研究了RE添加量对该钎料合金显微组织及性能的影响。结果表明,添加微量的RE能显著细化该钎料合金组织,抑制金属间化合物的生长,改善合金的组织分布,提高钎料的润湿性及力学性能。当w(RE)为0.10%时,钎料的润湿力、拉伸强度分别为3.02mN和31.3MPa。但随着RE的增加,钎料的溶铜速率会逐渐增大,抗氧化性变差。综合考虑,该钎料中w(RE)应控制在0.05%～0.10%。In order to explore the influence of RE （rare earths） on the Sn-0.70Cu-0.05Ni solder alloy,various micro amounts of RE,which are mainly La and Ce,were added into this alloy and their properties were investigated.The results show that adding micro amount of RE could refine the microstructure of the solder alloy and inhibit the growth of intermetallic compounds.Meanwhile,more uniform microstructure,improvements of the wettability and mechanical properties were obtained with RE addition.When the mass fraction of RE reaches 0.10%,the wetting force and tensile strength of the solder alloy are 3.02 mN and 31.3 MPa,respectively.However,the addition of RE could also accelerate the copper dissolution and solder oxidation rate.By analyzing the above results,it could be found that the suitable mass fraction of the RE addition on Sn-0.70Cu-0.05Ni solder alloy is within 0.05%-0.10%.

关 键 词：Sn-0.70Cu-0.05Ni 无铅钎料 混合稀土 溶铜性 力学性能 

分 类 号：TG425[金属学及工艺—焊接]