Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications  

作　　者：ZHANG Ximin GUO Hong YIN Fazhang FAN Yeming ZHANG Yongzhong 

机构地区：[1]National Engineering Research Center for Nonferrous Metals Composites,General Research Institute for Non-ferrous Metals,Beijing 100088,China

出　　处：《Rare Metals》2011年第1期94-98,共5页稀有金属（英文版）

基　　金：supported by the High-Tech Research and Development Program of China (Nos.2006AA03A135 and 2008AA03Z505)

摘　　要：Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion（CTE） of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were in good agreement with the predictions of the Kerner＇ model.Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion（CTE） of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were in good agreement with the predictions of the Kerner＇ model.

关 键 词：composite materials copper interfaces bonding electronic packaging INFILTRATION 

分 类 号：TB39[一般工业技术—材料科学与工程] V258.3[航空宇航科学与技术—航空宇航制造工程]