磁控溅射法制备CrTiAlCN镀层中主要元素的化学态  

Chemical states of the main elements in CrTiAlCN coating based on magnetron sputtering plating technique

作　　者：胡鹏飞[1] 蒋百灵[1] 李洪涛[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《金属热处理》2011年第2期41-44,共4页Heat Treatment of Metals

基　　金：国家"863"科技攻关项目(2005AA33H010)

摘　　要：采用闭合场非平衡磁控溅射离子镀技术在单晶硅(111)衬底上沉积了CrTiAlCN镀层,研究了不同C靶电流CrTiAlCN物相组成,并分析了镀层中主要元素的化学态。X射线衍射分析表明,当C靶电流IC从0增大到2.4 A时,镀层由晶态向非晶态转变;X射线光电子能谱分析表明,碳元素主要以C-C、C-Cr和C-Ti键形式存在;N元素是主要以CrN、Cr2N和TiN的形式存在;Cr元素主要以CrN、Cr2N及CrCx的形式存在。The CrTiAlCN coating was deposited on single crystal silicon（111） substrate using closed-field unbalanced magnetron sputtering ion plating technique.The phase constitution of the CrTiAlCN coating with different carbon target current and the chemical states of the main elements in the coating were investigated.The analysis of XRD shows that the coating transforms from crystalline state to amorphous state when the carbon target current increases from 0 A to 1.5 A.The analysis of XPS shows that the carbon exists mainly as the forms of C-C,C-Cr and C-Ti bond,the nitrogen element exists mainly as the forms of CrN,Cr2N and TiN,the chrome element exists mainly as the forms of CrN,Cr2N and CrCx.

关 键 词：磁控溅射 CrTiAlCN镀层 X射线衍射 X射线光电子能谱 碳键 

分 类 号：TG178[金属学及工艺—金属表面处理]