硅晶体切片设备的研究现状与进展  

The Research Actuality and Development of Slicing Wafer Equipment for Crystal Silicon

作　　者：侯志坚[1] 索海生[2] 

机构地区：[1]济南大学机械工程学院,山东济南250022 [2]济南铸造锻压机械研究所,山东济南250306

出　　处：《机床与液压》2011年第2期37-39,共3页Machine Tool & Hydraulics

摘　　要：介绍了硅晶体切片设备的原理及关键技术。典型的切片设备包括切片机和线切割锯床两类,其原理与结构不同,适用范围也不相同。内圆切片机的刀片与主轴相连并高速旋转,同时相对工件径向进给,因为刀片与工件为刚性接触,切割大直径硅片容易碎片。线锯能切割直径较大的硅片,环形金刚石线锯切割速度高,其去除机理与磨削相似,表面损伤层较浅。线锯床增加工件自转或锯丝辅助摇摆运动,可减小锯丝受力变化量,提高切片质量。因此环形金刚石线锯切片技术将会获得更广泛应用。The principle and key technology of slicing wafer equipments for crystal silicon are introduced. Typical slicing wafer equipments include diameter saw and wire saw that are different in principle and structure, so their using scope are different also. In diameter saw of inner circle, its cutting tool was connected directly with a spindle that revolved at high speed and the cutting tool fed in diameter direction at the same time. Because of the rigid contact between tool and silicon bar been cut, larger diameter silicon wafer was easy to fragment. The wire saw was generally used to slice larger diameters silicon. The looped diamond wire was higher at speed and its material remove mechanism was similar to grind, so the surface damage is shallower. To add a workpiece self-revolving or wire additional rocking motion was benefit to improve slicing quality, because of the decrease of cutting force variation from sawing wire. The looped diamond wire saw slicing technology will get more application.

关 键 词：硅晶体 切片 切片机 线锯 

分 类 号：TQ164[化学工程—高温制品工业]