代银镀层技术研究进展  

Advances in Research on Plating Technology of Substitute for Silver Coating

作　　者：王崇蕊[1] 郝建军[1] 董春艳[1] 刘新院[1] 

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳100159

出　　处：《电镀与精饰》2011年第2期24-27,共4页Plating & Finishing

摘　　要：介绍了几种替代银镀层的镀覆方法,其中有硫酸盐电解液镀锡、电镀锡-铈合金、酸性光亮镀锡-铈-铋合金等。化学镀Ni-P/Ni-B双层合金镀层,电镀和化学镀相结合的方法有化学镀锡和电镀锡-铈-锑合金。并归纳了各种代银镀层方法的特点,指出了代银镀层技术的发展趋势。Several plating methods of substitute for Silver coating such as tin electroplating with sulfate electrolyte,Sn-Ce and acid bright Sn-Ce-Bi alloy electroplating were described.Ni-P/Ni-B double-layer electroless plating,and tin electroless plating followed by Sn-Ce-Sb electroplating method were also introduced.The characteristics of these plating methods were briefly summarized,and the developing trends of these methods were put forward.

关 键 词：代银镀层 耐蚀性 可焊性 装饰性 

分 类 号：TQ153.19[化学工程—电化学工业]