制备铋靶的脉冲电镀工艺  

Pulse electroplating in bismuth target fabrication

作　　者：张红强[1] 戴亚堂[1] 张欢[1] 夏姣[1] 

机构地区：[1]西南科技大学四川省非金属复合与功能材料重点实验室-省部共建国家重点实验室培育基地,四川绵阳621010

出　　处：《强激光与粒子束》2011年第2期428-432,共5页High Power Laser and Particle Beams

基　　金：国家高技术发展计划项目;西南科技大学博士基金项目(08zx0101)

摘　　要：采用脉冲电镀工艺,以直径为1 mm的铜丝为芯轴,在无氰镀液体系中,制备出惯性约束聚变实验用铋靶所需的金属铋镀层。通过正交试验得到的最佳脉冲工艺条件为:电流密度5 A/cm2,频率600 Hz,占空比1∶6,温度20℃。利用扫描探针显微镜和扫描电子显微镜分别对铋镀层表面形貌进行分析,同时利用X射线衍射对铋镀层物相成分进行分析。表征结果表明:所得铋镀层表面细致均匀,孔隙率低,平整性好,无裂纹。Bismuth plating was obtained on copper substrate by using pulse electroplating in cyanide-free system.The optimal pulse parameters were determined by orthogonal test as follows： current density 5 A/cm^2,frequency 600 Hz,duty ratio 1∶6,temperature 20 ℃.Furthermore,scanning electron microscope and scanning probe microscope were used to characterize the morphology of the bismuth plating,and X-ray diffraction was used to analyze the phase components.The bismuth plating has fine and uniform grains,with low porosity,good smoothness and free of cracks.

关 键 词：铋靶 脉冲电镀 无氰镀液 乙二胺四乙酸盐 表面形貌 

分 类 号：TQ153.1[化学工程—电化学工业]