表面镀覆层与焊料的界面反应对可靠性的影响  

Effect on reliability of interface reaction of surface finishes and solders

作　　者：蒋廷彪[1] 周鹏[1] 徐龙会 

机构地区：[1]桂林电子科技大学,广西桂林541004 [2]青岛海信通信有限公司,山东青岛266510

出　　处：《电子元件与材料》2011年第3期65-68,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.60666002)

摘　　要：通过对SBGA器件与不同表面镀覆层(OSP,ENIG,HASL和Im-Ag)的PCB板互连形成的SnAgCu焊点在温度循环条件下的可靠性进行研究,对比SnPb焊膏,结合有限元仿真进行分析。结果表明:使用ENIG镀覆层的可靠性最好,SnPb样品的焊点失效率为0.98%,SnAgCu样品只有0.68%。温度循环后SnAgCu焊点的总体强度比SnPb焊点要高,SnAgCu样品最危险焊点的等效塑性应变为0.016,而SnPb的为0.028。The reliability of SnAgCu spots to joint SBGA and PCB with different finishes （OSP, ENIG, HASL and Im-Ag） was analyzed under temperature cycle condition and compared with the SnPb solder paste using the finite element simulation analysis. The results show that the joints have the best reliability when using the ENIG finishes, the spot failure rate of SnPb sample is 0.98%, the SnAgCu sample is only 0.68%. The overall strength of the SnAgCu spot is higher than that of the SnPb spot after the temperature cycling, the equivalent plastic strains of the most dangerous spots are 0.016, 0.028 on SnAgCu sample and SnPb sample, respectively.

关 键 词：表面镀覆层 无铅钎料 可靠性 

分 类 号：TM931[电气工程—电力电子与电力传动]