基于无铅SMT焊膏印刷参数优化控制研究  

The Study of Solder Paste Printing Parameter Optimizing Control based on Lead-free Sourface Mount Technology

作　　者：徐建丽[1] 

机构地区：[1]淮安信息职业技术学院,江苏淮安223003

出　　处：《电子与封装》2011年第2期1-3,共3页Electronics & Packaging

摘　　要：无铅表面组装制程是以模板印刷、表面贴装元件放置、回流焊或波峰焊为主要步骤。其中模板印刷制程在生产线中扮演第一个重要的步骤。文章设计了"印刷结果观测数字化实验"方法,并找出模板印刷工艺无铅化生产的最优化工作参数,得出NP-04LP丝网印刷机,0.127mm厚的不锈钢模板在使用Loctite LF320无铅焊膏时,考虑SMT整条工序的速率,优化的丝网印刷工艺参数为:压力设置:6 kg～8kg;印刷速度:25 mm/s～125mm/s,以供业界参考。The production system of SMT mainly includes six steps which are stencil printing,component placement,reflow soldering,adhesive dispense,wave soldering and inspection.Stencil printing acts as the first important step in the production line.This text designs printing observation numeric experiment to identify the process-optimized parameters of screen printing and obtains that pressure establishment is 6 kg ~8kg and Print speed is 25 mm/s ~125mm/s with NP-04LP silk-screen press and the 0.127mm thick stainless steel template and Loctite the LF320 non-lead soldering paste.

关 键 词：模板印刷 无铅化 优化 

分 类 号：TN305.94[电子电信—物理电子学]