国产大功率LED芯片的封装性能  

Package Performance of Domestic Power-LED Chips

作　　者：张瑞西[1] 王海波[1] 范供齐[2] 施丰华[2] 徐文飞[2] 

机构地区：[1]南京工业大学电光源材料研究所,江苏南京210015 [2]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《中国照明电器》2011年第2期5-8,共4页China Light & Lighting

基　　金：江苏省国际合作(SBZ200900225);江苏省自然科学基金(SBK201021101)

摘　　要：简单介绍了目前国内大功率LED芯片的现状,对部分产品进行了详细的封装研究,结果显示,国产芯片在光效方面提升迅速,最高已达110 lm/W,主流水平位于90～100 lm/W之间,但与进口产品相比都还存在较大差距;各个厂家的芯片封装的LED光源显色指数高低不一,其主要原因是芯片的峰值波长不同;在性价比方面,国产芯片价格已达到每百流明2元以下,具有较强的竞争力。The present situation of power-LED chips at home is introduced briefly. Some products are researched in detail by packaging. The results show： the luminous efficacy of domestic LED chip has been improved rapidly, it has reached ll01m/W, and the average level is about 90 ~1001m/W, but it still can not compare with the luminous efficacy of the imported products. The color rendering indexes of the packaged LEDs are uneven. The main cause is the different peak wavelengths of chips. In the aspect of cost performance, the hundred lumen price of a domestic chip has been less than 2 Yuan, that is very competitive.

关 键 词：LED芯片 封装 光效 性价比 

分 类 号：TN312.8[电子电信—物理电子学]