电子产品微组装技术  

Micro-Assembly Technology of Electronic Products

作　　者：周德俭[1,2] 

机构地区：[1]广西工学院,广西柳州545006 [2]桂林电子科技大学,广西桂林541004

出　　处：《电子机械工程》2011年第1期1-6,18,共7页Electro-Mechanical Engineering

摘　　要：微组装技术是电子产品先进制造技术中的关键技术之一,是电子产品制造中的电气互联技术的主体技术,是电子封装与组装技术发展到现阶段的代表技术。文中介绍了微组装技术的定义、特征等基本概念;分析探讨了微组装技术的技术体系及其与电气互联技术等相关技术的相互关系;论述了微组装技术的主要内容及其发展动态。Micro-assembly is one of the key technologies in the advanced manufacturing of electronic products.It is the main technology of electrical interconnection in electronic product manufacture and represents the current development of the electronic packaging and assembling technology.The basic concept and definition of the Micro-assembly technology and its characters are presented in this paper.The relationship between the technical system of the micro-assembly technology and the electric interconnecting technology are discussed.Then the main contents of micro-assembly technology and its development trend are introduced.

关 键 词：微组装技术 电气互联技术 概念 综述 

分 类 号：TN305[电子电信—物理电子学]