高导热T/R组件新型封装材料现状及发展方向  

Status and Prospects of New Materials with High Thermal Conductivity for T/R Module Packaging

作　　者：苏力争[1] 钟剑锋[1] 曹俊[1] 

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2011年第1期7-11,63,共6页Electro-Mechanical Engineering

摘　　要：随着微电子技术的发展,T/R组件热流密度越来越大,封装材料也面临新的挑战,对新型高热导封装材料的需求变得愈加迫切。文章首先综述了传统T/R封装材料的优势及不足之处,同时指出了目前我国新型封装材料所存在的问题及进一步完善的措施,对金属基封装材料的发展趋势进行了展望,并提出了高导热T/R封装材料当前及未来的研究方向。With the rapid development of micro-electronics technique,the packaging materials are facing the new challenge as the heat flux of T/R module is getting higher.The advantages and disadvantages of various traditional T/R module packaging materials are summarized in this paper at first.The problems and improving methods of new packaging materials used in our country are discussed.The future development of metal matrix composite is forecasted.Finally,the stratagem target and short term target of next-generation T/R module packaging materials with high thermal conductivity are proposed.

关 键 词：T/R组件 封装材料 低热膨胀系数 高热导率 

分 类 号：TB331[一般工业技术—材料科学与工程]