镍钛合金形状记忆薄膜的化学刻蚀  

Chemical Etching of Ni Ti SMA Film

作　　者：丁桂甫[1] 徐东[1] 赵小林[1] 张寿柏[1] 蔡炳初[1] 沈天慧[1] 

机构地区：[1]上海交通大学信息存储研究中心薄膜与微细加工开放实验室,上海200030

出　　处：《微细加工技术》1999年第3期20-26,共7页Microfabrication Technology

摘　　要：镍钛合金形状记忆薄膜的图形化技术曾是其实用化的主要障碍之一，现在，一种工作性能优越的化学刻蚀液可以实现薄膜的高精度图形化，该刻蚀液常温工作，性能稳定，刻蚀速率在１～５ 微米／分之间均可得到满意的刻蚀线条。常规制作的光刻胶掩模在该刻蚀液中非常稳定。该刻蚀液用于溅射态的形状记忆合金薄膜可得到与掩模图形完全一致的刻蚀结果，刻蚀线条光滑平直，刻蚀系数大于 １５。当用于热处理以后的薄膜时，刻蚀面有一定程度的粗糙化，只能用于刻蚀相对较粗的线条，这是热处理后薄膜中晶粒与晶界刻蚀速率不同所致。用该刻蚀液图形化的形状记忆合金薄膜驱动机构已成功用于微泵制造，所制作的微泵流量达到 ２００ 微升／分钟以上。The patterning problem of Ni Ti SMA film has been one of the main obstacles during the practical application of the film.An excellent chemical etchant was developed for obtaining the patterns with high precision.The etchant can be used at room temperature. It has stable performances and etching rate of 1～5μm/min with good etched lines.Common mask resist is very stable in the etchant.The etched patterns on the sputter formed SMA film are exactly the same as mask patterns.The etched lines are smooth and strainght and the etching factor is above 1.5.The etched surface is a bit rough when the etchant is used for the heat treated film.So,it could only be used for etching relatively thick lines because the ectching rates of crystals and crystal boundary are different.The SMA microactuator which is patterned in the etchant has been successfully used to make the micropump. The flowrate of the micropump is 200μl/min and more.

关 键 词：形状记忆合金 薄膜 化学刻蚀 微驱动机构 微泵 

分 类 号：O484[理学—固体物理] TG139.6[理学—物理]