Model analysis and experimental investigation of the friction torque during the CMP process  

作　　者：郭东明 徐驰 康仁科 金洙吉 

机构地区：[1]Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology

出　　处：《Journal of Semiconductors》2011年第3期140-144,共5页半导体学报（英文版）

基　　金：Project supported by the Joint Fund of NSFC with Guangdong Province,China(No.U0734008);the National Science and Technology Major Project of China(No.2009ZX02011)

摘　　要：A model for calculating friction torque during the chemical mechanical polishing（CMP） process is presented,and the friction force and torque detection experiments during the CMP process are carried out to verify the model.The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.A model for calculating friction torque during the chemical mechanical polishing（CMP） process is presented,and the friction force and torque detection experiments during the CMP process are carried out to verify the model.The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.

关 键 词：CMP friction torque endpoint detection 

分 类 号：TN305.2[电子电信—物理电子学]