面向IC封装的视觉定位系统设计  

The Design of the Vision Positioning System for IC Packaging Equipments

作　　者：刘晓斌[1] 涂佃柳[1] 柴斌[1] 单福源[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《电子工业专用设备》2011年第3期46-49,共4页Equipment for Electronic Products Manufacturing

摘　　要：以集成电路后道封装工序中的关键设备全自动砂轮划片机为例,详细阐述了面向IC封装的视觉识别定位系统的硬件结构和软件设计,在全自动砂轮划片机上开发了一套基于OpenCV视觉函数库的图像处理算法,控制划切工作台运动实现对IC工件划切街区的精确定位。在模板匹配方式上,该算法采用比较流行的边缘几何特征匹配方式,并在砂轮划片机的现场测试中取得了较为理想的效果。The hardware structure and software design of the vision positioning system for IC packaging equipment,taking the auto grinding dicing saw for example.An Image processing algorithm based on Open CV Vision Library is developed to control the movement of the work table,so that the dicing street of the work pieces could be precisely positioned.As to template matching,this algorithm adopts the popular edge geometry matching method,and has achieved acceptable result in the field test of the grinding dicing saw.

关 键 词：集成电路 视觉定位 特征点集 SUSAN滤波 划切街区 

分 类 号：TN407[电子电信—微电子学与固体电子学]