钾盐对氰化镀铜溶液性能的影响  

Effect of Potassium Salt on Performances of Cyanide Copper Plating Solution

作　　者：郭崇武[1] 

机构地区：[1]广州超邦化工有限公司,广东广州510460

出　　处：《电镀与精饰》2011年第3期27-28,40,共3页Plating & Finishing

摘　　要：研究了钾盐对氰化镀铜溶液性能的影响,结果表明,向镀液中加30～60 g/L的硫酸钾,能够明显提高镀层的光亮度和镀液的覆盖能力,当采用较低质量浓度氰化镀铜溶液时,硫酸钾能够提高镀液的分散能力。生产实践表明:在挂镀氰化镀铜槽中用硫酸钾取代有机光亮剂能够提高镀层与基体之间的结合力。Effect of potassium salt on performances of cyanide copper plating solution was studied. Experimental results show that brightness of the electroplating layer and covering power of the solution can be obviously improved after 30 -60 g/L potassium sulfate is added to a cyanide plating bath, and throwing power can be heightened by the potassium sulfate when using lower concentration cyanide plating solution. Production practice indicates that, in a rack cyanide plating bath, substituting potassium sulfate for organic addition agents can improve bonding strength between the copper layer and substrate.

关 键 词：氰化镀铜 硫酸钾 光亮度 分散能力 覆盖能力 

分 类 号：TQ153.14[化学工程—电化学工业]