Sn-Ag-Cu-Sb无铅焊料物理性能  

Research on Physical Properties of Sn-Ag-Cu-Sb Solder

作　　者：桂太龙[1] 袁力鹏[1] 郝龙[1] 贾伟[1] 董小丽[1] 

机构地区：[1]哈尔滨理工大学应用科学学院,黑龙江哈尔滨150080

出　　处：《哈尔滨理工大学学报》2011年第1期22-24,共3页Journal of Harbin University of Science and Technology

基　　金：黑龙江省自然科学项目(E200809)

摘　　要：为了获得不同性能的电子封装焊料,制备了掺杂Sb(锑)的Sn-3.35Ag-0.7Cu无铅焊料合金,并对其密度、杨氏模量、硬度等重要物理性能进行了测定.测得该无铅焊料的密度为7.210 6 g/cm3,杨氏模量为43 GPa,硬度为96.7 N/mm2.实验结果表明,同未掺杂Sn-3.35Ag-0.7Cu焊料合金相比,硬度略有降低,熔点下降不明显,但密度有显著降低,杨氏模量、润湿性有明显的提高.We prepare of the doped Sb（antimony） of the Sn-3.35Ag-0.7Cu lead-free solder alloy.Its important physical properties were measured： density,Young＇s modulus,hardness and so on.The density is 7.210 6g/cm3,Young＇s modulus is 43GPa,and the hardness is 96.7 N/mm2.The experimental results show that non-doped with Sn-3.35Ag-0.7Cu solder alloys,the hardness slightly lower,the melting points do not drop obviously than that not doped.However,there is a significant reduction in density.Young＇s modulus and wetting p properties are significantly improved.

关 键 词：无铅焊料 密度 杨氏模量 硬度 

分 类 号：TB331[一般工业技术—材料科学与工程]