UV-LIGA技术制备微细金结构试验研究  

Research of Micro Gold Structure by UV-LIGA Technique

作　　者：郝光亮[1] 曲宁松[1] 李寒松[1] 曾永彬[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点试验室,江苏南京210016

出　　处：《电加工与模具》2011年第B04期42-45,共4页Electromachining & Mould

摘　　要：利用基于SU-8光刻胶的UV-LIGA技术加工微细金结构。针对所沉积的微结构出现凹形的现象,建立了加工过程的电场数学模型,利用有限元方法对这种现象进行仿真研究,发现当光刻胶厚度大于微结构厚度时,可以明显改善这种情况。另外,试验还研究了阴阳极距离、电流密度对沉积层表面平整度的影响。优化参数组合,最终制备出厚度0.2 mm的微细金结构。Gold micro-structure is fabricated by means of UV-LIGA technique which based on SU-8 photoresist. The deposited micro-structure is naturally a concave shape over the whole area. The distribution of deposited layer thickness is analyzed on the basis of the electric field mathematical mod- el. The simulation results show that when the photoresist thicker than micro-structure thickness can significantly improve the situation. In addition, the influences of distance between anode and cathode, current density are studied by experiment. Finally,the micro-structure of 200urn thick are obtained by the optimized parameters.

关 键 词：UV—LIGA 仿真 表面平整度 

分 类 号：TG146.31[一般工业技术—材料科学与工程]