单组份环氧树脂-银导电胶的制备研究  

Study on One Part Epoxy-Ag Conductive Adhesive

作　　者：王萍[1] 金石磊[1] 李小慧[1] 顾哲明[1] 

机构地区：[1]上海材料研究所上海工程材料应用评价重点实验室,上海200437

出　　处：《广州化工》2011年第5期62-64,共3页GuangZhou Chemical Industry

基　　金：上海市纳米基金项目(1052nm02500)

摘　　要：选用微米级片状银粉作为导电填料,环氧树脂和咪唑类潜伏型固化剂作为基体树脂制备导电胶。通过扫描电镜研究了银粉含量对导电胶固化后的形貌,测试体积电阻率和拉伸性能与银粉填充量变化的关系。依照以上结论,探讨了导电胶的导电机理,并提出导电模型。The conductive adhesive was prepared by using micron flake Ag powder as conductive filler,and epoxy resin and imidazole curing agent as resin matrix.The effect of the content of Ag on the morphology,volume resistivity and tensile property were studied by scanning electrical microscopy.Based on the conclusion,the conductive mechanism was discussed.

关 键 词：导电胶 体积电阻率 拉伸性能 导电机理 

分 类 号：TQ131.2[化学工程—无机化工]