新型无卤素免清洗助焊剂的研制  

Development of a new type of halogen-free no-clean flux

作　　者：孙福林[1] 张宇航[1] 蔡志红[1] 胡泽宇[1] 朱火清[1] 

机构地区：[1]广东省工业技术研究院(广州有色金属研究院),广东广州510650

出　　处：《材料研究与应用》2011年第1期49-52,共4页Materials Research and Application

摘　　要：在助焊剂中添加羟基酸X能显著提高Sn-0.7Cu无铅焊料的铺展和润湿性,添加醇醚类表面活性剂Y能大幅降低焊料的表面张力.同时添加羟基酸X和醇醚类表面活性剂Y的助焊剂能有效地提高Sn-0.7Cu无铅焊料的可焊性;与传统助焊剂相比,该助焊剂对Sn-0.7Cu无铅焊料的最大润湿能力提高27%,润湿时间缩短16.2%.Adding hydroxycarboxylic X in the flux can significantly improve the spreadability and wettability of Sn-0.7Cu lead-free solder; adding surface active agents Y in the flux can greatly reduce surface tension of the solder. And the flux with the addition of both the hydroxycarboxylic X and surface active agents Y can efficiently improve the weldability of the Sn-0.7Cu lead-free solder. Compared with the traditional flux, this flux can improve the maximum wetting ability of Sn-0.7Cu lead-free solder by 27 percent and reduce the wetting time by 16.2 percent.

关 键 词：助焊剂 无卤素 免清洗 环保 

分 类 号：TN604[电子电信—电路与系统]