激光喷射钎料球键合工艺影响因素分析  

Impact factor analysis of laser jet solder ball bonding process

作　　者：王晓林[1] 李明雨[1] 王春青[2] 

机构地区：[1]哈尔滨工业大学深圳研究生院材料学科部,深圳市518055 [2]哈尔滨工业大学现代焊接生产技术国家重点试验室,150001

出　　处：《焊接》2010年第12期38-42,共5页Welding & Joining

基　　金：国家高新技术研究发展计划(2007AA217022)

摘　　要：新型的激光喷射钎料球键合技术具有非接触、无钎剂、热量小等优点。与普通钎焊方法相比,其具有冲击变形及瞬时凝固的特点,体现出了特有的工艺过程特征。因此,文中对工艺参数、焊盘表面粗糙度、金属化层厚度及表面元素对钎料球的润湿铺展过程进行了试验研究。结果表明,不同的激光能量调制方式对铺展率的影响不同,存在着最佳的粗糙度值使得铺展率最大,焊盘Cu层厚度的增加会降低铺展率,钎料润湿性对焊盘表面的有机物及Ni等杂质元素极为敏感。Laser jet solder ball bonding process is a newly developed technology which has many advantages such as non-contact,flux free, small amount of heat input and so on.Compared to the traditional reflow soldering methods,laser jet solder ball bonding method involves unique physical characteristics of shock deformation and instantaneous solidification of solder ball.The influences of laser energy,N_2 pressure, soldering pad roughness,metallization thickness and organic contaminant on the spreading performance of solder were experimentally investigated. Results show that the increase of electrical current can play more significant role than pulse width does on the spreading ratio of solder;a little trace of organic contaminant and Ni significantly degrade the wettability of solder.

关 键 词：激光 喷射钎料球键合 SNAGCU 润湿铺展 

分 类 号：TG454[金属学及工艺—焊接]